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INTEGRATED CIRCUITS
DATA SHEET
TDA8552T; TDA8552TS 2 x 1.4 W BTL audio amplifiers with digital volume control and headphone sensing
Preliminary specification Supersedes data of 1998 Feb 26 File under Integrated Circuits, IC01 1998 Jun 02
Philips Semiconductors
Preliminary specification
2 x 1.4 W BTL audio amplifiers with digital volume control and headphone sensing
FEATURES * One pin digital volume control (for each channel) * Volume setting with up/down pulses * Auto repeat function on volume setting * Headphone sensing * Maximum gain set by selection pin * Low sensitivity for EMC radiation * Internal feedback resistors * Flexibility in use * Few external components * Low saturation voltage of output stage * Standby mode controlled by CMOS compatible levels * Low standby current * No switch-on/switch-off plops * High supply voltage ripple rejection * Protected against electrostatic discharge * Outputs short-circuit safe to ground, VDD and across the load * Thermally protected. APPLICATIONS * Portable consumer products * Notebook computers * Communication equipment. ORDERING INFORMATION TYPE NUMBER TDA8552T TDA8552TS PACKAGE NAME SO20 DESCRIPTION
TDA8552T; TDA8552TS
GENERAL DESCRIPTION The TDA8552T is a two channel audio power amplifier that provides an output power of 2 x 1.4 W into an 8 load using a 5 V power supply. The circuit contains two BTL power amplifiers, two digital volume controls and standby/mute logic. Volume and balance of the amplifiers are controlled using two digital input pins which can be driven by simple push-buttons or by a microcontroller. Using the selection pin (GAINSEL) the maximum gain can be set at 20 or 30 dB. The headphone sense input (HPS) can be used to detect if a headphone is plugged into the jack connector. If a headphone is plugged into the jack connector the amplifier switches from the BTL to the SE mode and the BTL loudspeakers are switched off. This also results in a reduction of quiescent current consumption. The TDA8552T is contained in a 20-pin small outline package. For the TDA8552TS, which is contained in a 20-pin very small outline package, the maximum output power is limited by the maximum allowed ambient temperature. More information can be found in Section "Thermal design considerations". The SO20 package has the four corner leads connected to the die pad so that the thermal behaviour can be improved by the PCB layout.
VERSION SOT163-1 SOT266-1
plastic small outline package; 20 leads; body width 7.5 mm
SSOP20 plastic shrink small outline package; 20 leads; body width 4.4 mm
1998 Jun 02
2
Philips Semiconductors
Preliminary specification
2 x 1.4 W BTL audio amplifiers with digital volume control and headphone sensing
QUICK REFERENCE DATA SYMBOL VDD Iq PARAMETER supply voltage quiescent supply current BTL mode; VDD = 5 V BTL mode; VDD = 3.3 V SE mode; VDD = 5 V SE mode; VDD = 3.3 V Istb Po Gv standby current output power voltage gain THD = 10%; RL = 8 ; VDD = 5 V low gain; maximum volume low gain; minimum volume high gain; maximum volume high gain; minimum volume Nstep THD SVRR number of volume steps total harmonic distortion supply voltage ripple rejection Po = 0.5 W CONDITIONS - - - - - 1 - - - - - - 50
TDA8552T; TDA8552TS
MIN. 2.7 5
TYP. 14 10 8.5 5 1 1.4 20 -60 30 -50 64 0.1 -
MAX. 5.5 20 15 12 8 10 - - - - - - - - V
UNIT mA mA mA mA A W dB dB dB dB % dB
1998 Jun 02
3
Philips Semiconductors
Preliminary specification
2 x 1.4 W BTL audio amplifiers with digital volume control and headphone sensing
BLOCK DIAGRAM
TDA8552T; TDA8552TS
handbook, full pagewidth
VDD1 3 IN1 17 20 k VOLUME CONTROL
VDD2 8
VDD3 13
VDD4 18
MASTER 15 k 20 dB 3.4 k VDD down 30 dB 1.6 k 0.5VDD 15 k 0.5VDD
12 OUT1+
0.5VDD
UP/DOWN COUNTER up UP/DOWN1 6
20 k 20 k
INTERFACE
SLAVE
19 OUT1-
SVR
16 0.5VDD
IN2 15 20 k
15 k VOLUME CONTROL
TDA8552T
MASTER 15 k 20 dB 3.4 k VDD down 15 k 30 dB 1.6 k 0.5VDD 0.5VDD
2 OUT2+
0.5VDD
UP/DOWN COUNTER up UP/DOWN2 7
20 k 20 k
INTERFACE
SLAVE
9 OUT2-
0.5VDD 15 k
MODE 5 HPS 4 STANDBY/MUTE AND OPERATING GAIN SELECTION 14 GAINSEL 1, 10, 11, 20 GND1 to GND4
MGM608
Fig.1 Block diagram.
1998 Jun 02
4
Philips Semiconductors
Preliminary specification
2 x 1.4 W BTL audio amplifiers with digital volume control and headphone sensing
PINNING SYMBOL GND1 OUT2+ VDD1 HPS MODE PIN(1) 1 2 3 4 5 DESCRIPTION ground 1, substrate/leadframe positive loudspeaker terminal output channel 2 supply voltage 1 digital input for headphone sensing digital trinary input for mode selection (standby, mute and operating) digital trinary input for volume control channel 1 digital trinary input for volume control channel 2 supply voltage 2 negative loudspeaker terminal output channel 2 ground 2, substrate/leadframe ground 3, substrate/leadframe positive loudspeaker terminal output channel 1 supply voltage 3 digital input for gain selection audio input channel 2 half supply voltage, decoupling ripple rejection audio input channel 1 supply voltage 4 negative loudspeaker terminal output channel 1 ground 4, substrate/leadframe
handbook, halfpage
TDA8552T; TDA8552TS
GND1 1 OUT2+ 2 VDD1 3 HPS 4 MODE 5
20 GND4 19 OUT1- 18 VDD4 17 IN1 16 SVR
UP/DOWN1 UP/DOWN2 VDD2 OUT2- GND2 GND3 OUT1+ VDD3 GAINSEL IN2 SVR IN1 VDD4 OUT1- GND4 Note
6 7 8 9 10 11 12 13 14 15 16 17 18 19 20
TDA8552T
UP/DOWN1 6 UP/DOWN2 7 VDD2 8 OUT2- 9 GND2 10
MGM610
15 IN2 14 GAINSEL 13 VDD3 12 OUT1+ 11 GND3
Fig.2 Pin configuration.
1. For the SO20 (SOT163-1) package only: the ground pins 1, 10, 11 and 20 are mechanically connected to the leadframe and electrically to the substrate of the die. On the PCB the ground pins can be connected to a copper area to decrease the thermal resistance.
1998 Jun 02
5
Philips Semiconductors
Preliminary specification
2 x 1.4 W BTL audio amplifiers with digital volume control and headphone sensing
FUNCTIONAL DESCRIPTION The TDA8552T is a 2 x 1.4 W BTL audio power amplifier capable of delivering 2 x 1.4 W output power into an 8 load at THD = 10% using a 5 V power supply. The gain of the amplifier can be set by the digital volume control. The gain in the maximum volume setting is 20 dB (low gain) or 30 dB (high gain). This maximum gain can be selected by the gain selection pin. The headphone sense input (HPS) can be used to detect if a headphone is plugged into the jack connector. If a headphone is plugged into the jack connector the amplifier switches from the BTL to the SE mode and the BTL loudspeakers are switched off. This also results in a reduction of quiescent current consumption. Using the MODE pin the device can be switched to the standby condition, the mute condition or the normal operating condition. The device is protected by an internal thermal shutdown protection mechanism. Power amplifier The power amplifier is a Bridge-Tied Load (BTL) amplifier with a complementary CMOS output stage. The total voltage loss for both output power MOS transistors is within 1 V and with a 5 V supply and an 8 loudspeaker an output power of 1.4 W can be delivered. The total gain of this power amplifier can be set at 20 or 30 dB by the gain selection pin. Gain selection The gain selection can be used for a fixed gain setting, depending on the application. The gain selection pin must be hard wired to ground (20 dB) or to VDD (30 dB). Gain selecting during the operation is not advised, switching is not guaranteed plop free. Input attenuator The volume control operates as a digitally controlled input attenuator between the audio input pin and the power amplifier. In the maximum volume control setting the attenuation is 0 dB and in the minimum volume control setting the typical attenuation is 80 dB. The attenuation can be set in 64 steps by the UP/DOWN pin. Both attenuators for channels 1 and 2 are separated from each other and are controlled by there own UP/DOWN pin. Balance control can be arranged by applying UP/DOWN pulses only on pins 6 and 7, see Fig.5. Volume control
TDA8552T; TDA8552TS
Each attenuator is controlled with its own UP/DOWN pin (trinary input): * Floating UP/DOWN pin: volume remains unchanged * Negative pulses: decreasing volume * Positive pulses: increasing volume. Each pulse on the UP/DOWN pin results in a change in 80 gain of ----- = 1.25 dB (typical value). 64 In the basic application the UP/DOWN pin is switched to ground or VDD by a double push-button. When the supply voltage is initially connected, after a complete removal of the supply, the initial state of the volume control is an attenuation of 40 dB (low volume), so the gain of the total amplifier is -20 dB in the low gain setting or -10 dB in the high gain setting. After powering-up, some positive pulses have to be applied to the UP/DOWN pin for turning up to listening volume. Auto repeat If the UP/DOWN pin is LOW or HIGH for the wait time (twait in seconds) (one of the keys is pressed) then the device starts making up or down pulses by itself with a frequency 1 given by ------- (repeat function). t rep The wait time and the repeat frequency are set using an internal RC oscillator with an accuracy of 10%. Volume settings in standby mode When the device is switched with the MODE select pin to the mute or the standby condition, the volume control attenuation setting keeps its value, under the assumption that the voltage on the VDD pin does not fall below the minimum supply voltage. After switching the device back to the operation mode, the previous volume setting is maintained. In the standby mode the volume setting is maintained as long as the minimum supply voltage is available. The current consumption is very low, approximately 1 A (typ.). In battery fed applications the volume setting can be maintained during battery exchange if there is a supply capacitor available.
1998 Jun 02
6
Philips Semiconductors
Preliminary specification
2 x 1.4 W BTL audio amplifiers with digital volume control and headphone sensing
Mode select pin The device is in the standby mode (with a very low current consumption) if the voltage at the MODE pin is between VDD and VDD - 0.5 V. At a mode select voltage level of less than 0.5 V the amplifier is fully operational. In the range between 1 V and VDD - 1 V the amplifier is in the mute condition. The mute condition is useful for using it as a `fast mute', in this mode the output signal is suppressed, while the volume setting remains at its value. It is advised to keep the device in the mute condition while the input capacitor is being charged. This can be achieved by holding the MODE pin at a level of 0.5VDD, or by waiting approximately 100 ms before giving the first volume-UP pulses. Headphone sense pin (HPS) A headphone can be connected to the amplifier by using a coupling capacitor for each channel. The common ground pin of the headphone is connected to the ground of the amplifier, see Fig.4. By using the HPS pin as illustrated in Fig.4, the TDA8552T detects if a headphone jack plug is inserted into the connector.
TDA8552T; TDA8552TS
When no headphone is plugged in, the voltage level at the HPS pin will remain LOW. A voltage less than VDD - 1 V at the HPS pin will keep the device in the BTL mode, thus the loudspeakers can be operational. If the HPS pin is not connected then the device will remain in the BTL mode. When a headphone is plugged into the connector, the voltage at the HPS pin will be set to VDD. The device then switches to the Single-Ended (SE) mode, this means that the slave power amplifiers at the outputs OUT1- and OUT2- will be switched to the standby mode. This results in floating outputs OUT1- and OUT2-, the loudspeaker signal is thus attenuated by approximately 80 dB and only the headphone can operate. One of the benefits of this system is that the loudspeaker current does not flow through the jack connector switch, which could give some output power loss. The other benefit is that the quiescent current is reduced when the headphone jack is inserted.
1998 Jun 02
7
Philips Semiconductors
Preliminary specification
2 x 1.4 W BTL audio amplifiers with digital volume control and headphone sensing
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL VDD Vi IORM Tstg Tamb Vsc Ptot supply voltage input voltage repetitive peak output current storage temperature operating ambient temperature AC and DC short-circuit safe voltage maximum power dissipation SO20 SSOP20 PARAMETER
TDA8552T; TDA8552TS
CONDITIONS operating
MIN. -0.3 -0.3 - -55 -40 - - -
MAX. +5.5 VDD + 0.3 1 +150 +85 5.5 2.2 1.1 V V A
UNIT
C C V W W
THERMAL CHARACTERISTICS See Section "Thermal design considerations" in Chapter "Test and application information". SYMBOL Rth(j-a) PARAMETER thermal resistance from junction to ambient for the TDA8552T (SO20) for the TDA8552TS (SSOP20) in free air extra copper in free air extra copper Table 1 Power rating; note 1 MUSIC POWER VDD (V) RL () Po (W) THD = 10% 0.9 0.6 0.3 0.035 2.0 1.4 0.8 0.09 0.9 1.4 OPERATION Pmax (W) BTL BTL BTL headphone BTL BTL BTL headphone BTL BTL 0.55 0.28 0.14 0.03 1.25 0.65 0.32 0.07 1.1 1.25 Tamb(max) (C) SO20 120 134 142 150 81 114 132 146 continuous sine wave 3.3 5 Note 1. The power rating is based on Rth(j-a) with recommended copper pattern of at least 4 x 1 cm2 to the corner leads and copper under the IC package. 4 8 89 81 62 50 SSOP20 106 127 139 150 50 98 124 144 60 55 110 80 K/W K/W K/W K/W CONDITIONS VALUE UNIT
3.3 3.3 3.3 3.3 5.0 5.0 5.0 5.0
4 8 16 32SE 4 8 16 32SE
1998 Jun 02
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Philips Semiconductors
Preliminary specification
2 x 1.4 W BTL audio amplifiers with digital volume control and headphone sensing
QUALITY SPECIFICATION
TDA8552T; TDA8552TS
Quality specification in accordance with "SNW-FQ-611 part E", if this type is used as an audio amplifier. DC CHARACTERISTICS VDD = 5 V; Tamb = 25 C; RL = 8 ; VMODE = 0 V; total gain setting at 7 dB; according to Fig.4.; unless otherwise specified. SYMBOL VDD IDD PARAMETER supply voltage supply current BTL mode; VDD = 5 V; RL = ; note 1 SE mode; VDD = 5 V BTL mode; VDD = 3.3 V; RL = ; note 1 SE mode; VDD = 3.3 V Istb VO standby current DC output voltage VMODE = VDD note 2 GAINSEL = 0 V GAINSEL = VDD standby mute operating IMODE mute Gain select pin VGAINSEL IGAINSEL VHPS IHPS input voltage input current low gain (20 dB) high gain (30 dB) Headphone sense pin input voltage input current SE mode; headphone detected VDD - 1 - - - VDD 1 V A 0 4.1 - - - - 0.6 VDD 1 V V A input current mute attenuation 0 < VMODE < VDD note 3 CONDITIONS - - - - - - - - MIN. 2.7 5 14 8.5 10 5 1 2.5 - - TYP. MAX. 5.5 20 12 15 8 10 - 50 150 UNIT V mA mA mA mA A V mV mV
VOUT+ - VOUT- differential output offset voltage Mode select pin VMODE input voltage
VDD - 0.5 - 1 0 - 80 - - - tbf
VDD 0.5 1 -
V V A dB
VDD - 1.4 V
1998 Jun 02
9
Philips Semiconductors
Preliminary specification
2 x 1.4 W BTL audio amplifiers with digital volume control and headphone sensing
SYMBOL Volume control tW trep Vth(up) Vfloat(max) Vfloat(min) Vth(down) II(up/down) twait trep Gv(l) pulse width pulse repetition time UP/DOWN pin UP threshold level UP/DOWN pin floating high level UP/DOWN pin floating low level UP/DOWN pin DOWN threshold level input current UP/DOWN pin auto repeat wait time repeat time key pressed 0 < VUP/DOWN < VDD PARAMETER CONDITIONS
TDA8552T; TDA8552TS
MIN. - - - - - - -
TYP. - -
MAX.
UNIT
50 100 4.1 - 1.0 0 - - -
ns ns V V V V A ms ms
VDD 3.4 - 0.6 200 - -
500 130
Volume attenuator low gain; maximum volume (including power amplifier) low gain; minimum volume (including power amplifier) Gv(h) high gain; maximum volume (including power amplifier) high gain; minimum volume (including power amplifier) Nstep Gv Zi Vi(max)(rms) Notes 1. With a load connected at the outputs the quiescent current will increase, the maximum of this increase being equal DC output offset voltage to 2 x --------------------------------------------------------------- RL 2. The DC output voltage with respect to ground is approximately 0.5VDD. 3. Output voltage in mute position is measured with an input of 1 V (RMS) in a bandwidth of 20 kHz, so including noise, gain select pin is LOW (0 V). number of gain steps variation of gain per step input impedance maximum input voltage (RMS value) 19 tbf 29 tbf - - 14 - 20 -60 30 -50 64 1.25 20 - 21 tbf 31 tbf - - - 1.75 dB k V dB dB dB dB
1998 Jun 02
10
Philips Semiconductors
Preliminary specification
2 x 1.4 W BTL audio amplifiers with digital volume control and headphone sensing
AC CHARACTERISTICS (VDD = 3.3 V)
TDA8552T; TDA8552TS
Tamb = 25 C; RL = 8 ; f = 1 kHz; total gain setting at 7 dB; VMODE = 0 V; gain select pin is at 0 V (maximum gain = 20 dB); according to Fig.4. SYMBOL Po PARAMETER output power CONDITIONS THD = 10%; RL = 4 THD = 10%; RL = 8 THD = 10%; RL = 16 THD = 0.5%; RL = 4 THD = 0.5%; RL = 8 THD = 0.5%; RL = 16 THD Vo(n) SVRR Vi(max) sup cs Notes 1. Volume setting at maximum. 2. The noise output voltage is measured at the output in a frequency band from 20 Hz to 20 kHz (unweighted), Rsource = 0 , gain select pin is LOW (0 V). 3. Supply voltage ripple rejection is measured at the output, with a source impedance of Rsource = 0 at the input. The ripple voltage is a sine wave with a frequency of 1 kHz and an amplitude of 100 mV (RMS) is applied to the positive supply rail, gain select pin is LOW (0 V). 4. Channel suppression is measured at the output with a source impedance of Rsource = 0 at the input and a frequency of 1 kHz. The output level in the operating single-ended channel (OUT+) is set at 2 V (RMS). total harmonic distortion noise output voltage supply voltage ripple rejection maximum input voltage channel suppression channel separation Po = 0.1 W; note 1 note 2 note 3 THD = 1%; Gv = -50 to 0 dB VHPS = VDD; note 4 - - - - - - - - tbf - - - MIN. TYP. 0.9 0.6 0.3 0.6 0.4 0.2 0.1 60 55 - 80 55 - - - - - - - - - 1.1 - - MAX. W W W W W W % V dB V dB dB UNIT
1998 Jun 02
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Philips Semiconductors
Preliminary specification
2 x 1.4 W BTL audio amplifiers with digital volume control and headphone sensing
AC CHARACTERISTICS (VDD = 5 V)
TDA8552T; TDA8552TS
Tamb = 25 C; RL = 8 ; f = 1 kHz; total gain setting at 7 dB; VMODE = 0 V; Gain select pin is at 0 V (maximum gain = 20 dB); according to Fig.4; package is SO20. SYMBOL Po PARAMETER output power CONDITIONS THD = 10%; RL = 8 THD = 10%; RL = 16 THD = 0.5%; RL = 8 THD = 0.5%; RL = 16 THD Vo(n) SVRR Vi(max) sup cs Notes 1. Volume setting at maximum. 2. The noise output voltage is measured at the output in a frequency band from 20 Hz to 20 kHz (unweighted), Rsource = 0 . 3. Supply voltage ripple rejection is measured at the output, with a source impedance of Rsource = 0 at the input. The ripple voltage is a sine wave with a frequency of 1 kHz and an amplitude of 100 mV (RMS) is applied to the positive supply rail, gain select pin is LOW (0 V). 4. Channel suppression is measured at the output with a source impedance of Rsource = 0 at the input and a frequency of 1 kHz. The output level in the operating single-ended channel (OUT+) is set at 1 V (RMS). total harmonic distortion noise output voltage supply voltage ripple rejection a maximum input voltage channel suppression channel separation Po = 0.1 W; note 1 Po = 0.5 W; note 1 GAINSEL. = 0 V; note 2 GAINSEL. = VDD; note 2 note 3 THD = 1%; Gv = -50 to 0 dB VHPS = VDD; note 4 - 0.6 - - - - - 50 - 70 50 MIN. 1.0 TYP. 1.4 0.8 1.0 0.6 0.15 0.1 60 100 55 - 80 - - - - - 0.4 0.3 100 - - 1.75 - - MAX. W W W W % % V V dB V dB dB UNIT
1998 Jun 02
12
Philips Semiconductors
Preliminary specification
2 x 1.4 W BTL audio amplifiers with digital volume control and headphone sensing
AC CHARACTERISTICS (FOR HEADPHONE; RL = 32 ; CONNECTED SE)
TDA8552T; TDA8552TS
VDD = 5 V; Tamb = 25 C; f = 1 kHz; total gain setting at 20 dB; VMODE = 0 V; gain select pin is 0 V (maximum gain = 20 dB); according to Fig.4. SYMBOL Po PARAMETER output power CONDITIONS THD = 10%; VDD = 3.3 V THD = 10%; VDD = 5.0 V - - MIN. TYP. 35 90 25 60 0.04 60 55 - - - - - - - 100 - 1.75 - MAX. UNIT mW mW mW mW % V dB V dB
THD = 0.5%; VDD = 3.3 V - THD = 0.5%; VDD = 5.0 V - THD Vo(n) SVRR Vi(max) cs Notes total harmonic distortion noise output voltage supply voltage ripple rejection maximum input voltage channel separation Po = 60 mW note 1 note 2 THD = 1%; Gv = -50 to 0 dB - - 50 - 50
1. The noise output voltage is measured at the output in a frequency band from 20 Hz to 20 kHz (unweighted), Rsource = 0 , gain select pin is LOW (0 V). 2. Supply voltage ripple rejection is measured at the output, with a source impedance of Rsource = 0 at the input. The ripple voltage is a sine wave with a frequency of 1 kHz and an amplitude of 100 mV (RMS) is applied to the positive supply rail, gain select pin is LOW (0 V).
handbook, full pagewidth
tr VDD Vth(UP) Vfloat(max)
trep
tw increasing volume
floating VUP/DOWN Vfloat(min) Vth(DOWN) 0 t
decreasing volume tr trep tw
MGM611
The rise time (tr) of the pulse may have any value.
Fig.3 Timing UP/DOWN pin.
1998 Jun 02
13
Philips Semiconductors
Preliminary specification
2 x 1.4 W BTL audio amplifiers with digital volume control and headphone sensing
TEST AND APPLICATION INFORMATION
TDA8552T; TDA8552TS
handbook, full pagewidth
VDD1, 2 C1 330 nF VIN1 3, 8 IN1 17 20 k VOLUME CONTROL MASTER 15 k 20 dB UP/DOWN COUNTER up up volume control down R5 2.2 k C7 100 nF UP/DOWN1 6 C3 220 F C2 330 nF VIN2 IN2 15 20 k VOLUME CONTROL MASTER 15 k 20 dB UP/DOWN COUNTER VDD up up volume control down R6 2.2 k UP/DOWN2 7 C8 100 nF down 15 k 1.6 k 0.5VDD 0.5VDD 9 OUT2- 3.4 k VDD 30 dB 20 k 20 k 8 2 OUT2+ down 3.4 k VDD 30 dB 1.6 k 0.5VDD 15 k SVR 16 0.5VDD 15 k 0.5VDD 19 OUT1- 20 k 20 k 8 12 OUT1+ C5 220 F 0.5VDD VDD3, 4 13, 18 C3 100 nF C4
VDD = 5 V 220 F
R1 1 k
VDD
INTERFACE
SLAVE
headphone jack tip ring sleeve C6 220 F R4 1 k
TDA8552T
0.5VDD
INTERFACE
SLAVE
0.5VDD 15 k
VDD standby mute MODE 5 operating HPS 4 STANDBY/MUTE AND OPERATING GAIN SELECTION 14 GAINSEL 1, 10, 11, 20 GND1 to GND4 R2 820 k VDD
R3 100 k VDD
ground
MGM609
Fig.4 Test and application diagram.
1998 Jun 02
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Philips Semiconductors
Preliminary specification
2 x 1.4 W BTL audio amplifiers with digital volume control and headphone sensing
Test conditions Tamb = 25C if not specially mentioned; VDD = 5 V; f = 1 kHz, RL = 8 , Gv = 20 dB, audio band-pass 22 Hz to 22 kHz. The thermal resistance (in standard print, without extra copper) = 110 K/W for the SSOP20; the maximum sine wave power dissipation is: 150 - 25 --------------------- = 1.14 W 110 For Tamb = 60 C the maximum total power dissipation is: 150 - 60 --------------------- = 0.82 W 110 Thermal design considerations The `measured' thermal resistance of the IC package is highly dependent on the configuration and size of the application board. All surface mount packages rely on the traces of the PCB to conduct heat away from the package. To improve the heat flow, a significant area on the PCB must be attached to the (ground) pins. Data may not be comparable between different semiconductor manufacturers because the application boards and test methods are not (yet) standardized. Also, the thermal performance of packages for a specific application may be different than presented here, because the configuration of the application boards (copper area) may be different. Philips Semiconductors uses FR-4 type application boards with 1 oz copper traces with solder coating Solder Resist Mask (SRM). The SSOP20 package has improved thermal conductivity which reduces the thermal resistance. Using a practical PCB layout (see Fig.18) with wider copper tracks to the corner pins and just under the IC, the thermal resistance from junction to ambient can be reduced to approximately 80 K/W. For Tamb = 60 C the maximum total power dissipation for this PCB layout is: 150 - 60 = 1.12 W --------------------80 The thermal resistance for the SO20 is approximately 55 K/W if applied to a PCB with wider copper tracks to the corner pins and just under the body of the IC. The maximum total power dissipation for this practical application is: 150 - 60 --------------------- = 1.63 W 55 BTL application
TDA8552T; TDA8552TS
The BTL application diagram is illustrated in Fig.4. The quiescent current has been measured without any load impedance. The total harmonic distortion as a function of frequency was measured with a low-pass filter of 80 kHz. The value of capacitor C3 influences the behaviour of the SVRR at low frequencies, increasing the value of C3 increases the performance of the SVRR. Headphone application Tamb = 25C if not specially mentioned, VDD = 5 V, f = 1 kHz, RL = 32 , Gv = 14 dB, audio band-pass 22 Hz to 22 kHz. For headphone application diagram see: Fig.4 If a headphone is plugged into the headphone jack, the HPS pin will switch-off the outputs of the SLAVE output stage, this results in a mute attenuation >80 dB for the loudspeakers. In this condition the quiescent current will be reduced. General remarks Reduction of the value of capacitor C3 results in a decrease of the SVRR performance at low frequencies. The capacitor value of C5 and C6 in combination with the load impedance of the headphone determines the low frequency behaviour. To prevent against high output currents during inserting the headphone into the headphone jack, resistors of 5.1 have to be connected in series with the SE output lines. The UP/DOWN pin can be driven by a 3-state logic output stage (microprocessor) without extra external components. If the UP/DOWN pin is driven by push-buttons, then it is advised to have an RC-filter between the buttons and the UP/DOWN pin. Advised values for the RC-filter are 2.2 k and 100 nF. Resistor R4 is not necessary for basic operation, but is advised to keep C6 charged to a voltage of 0.5VDD This has the advantage that the plop noise when inserting the headphone plug is minimal. If the headphone sense function (HPS) is not used then the HPS-pin 4 should be hard-wired to ground. This pin should never be left unconnected. Using double push buttons, the volume step for both channels can be controlled. When for the balance control only a single contact is used, the balance steps are 1.25 dB. If double contacts are used for the balance buttons and the dashed connection is made, then the balance steps are 2.5 dB. 15
1998 Jun 02
Philips Semiconductors
Preliminary specification
2 x 1.4 W BTL audio amplifiers with digital volume control and headphone sensing
Application without volume control
TDA8552T; TDA8552TS
If pins 6, 7 and 8 are hardwired together the device operates with the volume control setting at maximum. When the supply voltage is connected and the device is switched from standby to mute or operating for the first time then the gain is ramped up from -20 dB to +20 dB. This takes approximately 5 s. This maximum gain setting is maintained until the supply voltage drops below the minimum value.
handbook, full pagewidth
balance left VDD
up VDD volume
2.2 k
UP/DOWN1 100 nF
6
TDA8552T
2.2 k UP/DOWN2 100 nF down
MGM612
7
VDD balance right
Fig.5 Volume and balance control using buttons.
1998 Jun 02
16
Philips Semiconductors
Preliminary specification
2 x 1.4 W BTL audio amplifiers with digital volume control and headphone sensing
TDA8552T; TDA8552TS
MGR005
handbook, halfpage
20
handbook, halfpage
40
MGR006
IDD (mA) 15
G (dB) 20
0 10
(1)
-20 5
(2)
-40
0
2
3
4
5
VDD (V)
6
-60
0
20
40
60 volume steps
80
RL = .
VDD = 5 V; RL = 8 . (1) Gv = 30 dB (max.). (2) Gv = 20 dB (max.).
Fig.6 IDD as a function of VDD.
Fig.7 Gain as a function of volume steps.
handbook, halfpage
10
MGR007
handbook, halfpage
10
MGR008
THD (%) 1
(1) (2)
THD (%) 1
(1) (2) (3)
10-1
(3)
10-1
(4)
10-2 10-2
10-1
1
Po (W)
10
10-2 10-2
10-1
1
Po (W)
10
VDD = 5 V; RL = 8 ; f = 1 kHz; Gv = 30 dB (max.). VDD = 5 V; RL = 8 ; f = 1 kHz; Gv = 20 dB (max.). (1) Gv = 0 dB. (2) Gv = 7 dB. (3) Gv = 20 dB. (1) (2) (3) (4) Gv = 0 dB. Gv = 7 dB. Gv = 20 dB. Gv = 30 dB.
Fig.8 THD as a function of Po.
Fig.9 THD as a function of Po.
1998 Jun 02
17
Philips Semiconductors
Preliminary specification
2 x 1.4 W BTL audio amplifiers with digital volume control and headphone sensing
TDA8552T; TDA8552TS
handbook, halfpage
10
MGR009
handbook, halfpage
10
MGR010
THD (%) 1
(1)
THD (%) 1
(1)
(2) (2)
10-1
(3)
10-1
(3)
10-2 10-2
10-1
1
Po (W)
10
10-2 10-2
10-1
1
Po (W)
10
VDD = 5 V; RL = 8 ; Gv = 20 dB (max.). (1) f = 10 kHz. (2) f = 1 kHz. (3) f = 100 Hz.
VDD = 5 V; RL = 8 ; Gv = 30 dB (max.). (1) f = 10 kHz. (2) f = 1 kHz. (3) f = 100 Hz.
Fig.10 THD as a function of Po.
Fig.11 THD as a function of Po.
handbook, halfpage
10
MGR011
handbook, halfpage
10
MGR012
THD (%) 1
(1)
THD (%) 1
(1) (2)
10-1
(2)
(3)
10-1
(3)
10-2 10
102
103
104
f (Hz)
105
10-2 10
102
103
104
f (Hz)
105
VDD = 5 V; RL = 8 ; Po = 0.1 W; Gv = 20 dB (max.). (1) Gv = 0 dB. (2) Gv = 7 dB. (3) Gv = 20 dB.
VDD = 5 V; RL = 8 ; Po = 0.1 W; Gv = 30 dB (max.). (1) Gv = 0 dB. (2) Gv = 7 dB. (3) Gv = 30 dB.
Fig.12 THD as a function of frequency.
Fig.13 THD as a function of frequency.
1998 Jun 02
18
Philips Semiconductors
Preliminary specification
2 x 1.4 W BTL audio amplifiers with digital volume control and headphone sensing
MGR013
TDA8552T; TDA8552TS
handbook, halfpage
0
handbook, halfpage
2.4
MGR014
SVRR (dB)
(1)
Vi (V)
(1)
2
(2)
-20 (2)
(3) (4)
1.6
-40 (5)
1.2
0.8 -60 (6) 0.4
-80 10
102
103
104
f (Hz)
105
0 -50
-30
-10
0
10
G (dB)
30
VDD = 5 V; RL = 8 ; Vref = 100 mV. (1) C3 = 10 F; Gv = 20 dB. (2) C3 = 10 F; Gv = 7 dB. (3) C3 = 100 F; Gv = 20 dB. (4) C3 = 10 F; Gv = 10 dB. (5) C3 = 100 F; Gv = 7 dB. (6) C3 = 100 F; Gv = 10 dB.
VDD = 5 V; RL = 8 ; f = 1 kHz; THD = 1%. (1) Gv = 20 dB (max.). (2) Gv = 30 dB (max.).
Fig.14 SVRR as a function of frequency.
Fig.15 Input voltage as a function of gain.
handbook, halfpage
0
MGL436
sup (dB)
handbook, halfpage
0
MGL435
cs (dB)
-20
-20
-40
-40
-60
(1)
-60
(1) (2)
-80
(2)
-80
-100 10
102
103
104 f (Hz)
105
-100 10
102
103
104 f (Hz)
105
VP = 5 V; Vo = 1 V; VHPS = VP. (1) Channel 1. (2) Channel 2.
VP = 5 V; Vo = 1 V. (1) Gv = 30 dB. (2) Gv = 20 dB.
Fig.16 Channel suppression as a function of frequency.
Fig.17 Channel separation as a function of frequency.
1998 Jun 02
19
Philips Semiconductors
Preliminary specification
2 x 1.4 W BTL audio amplifiers with digital volume control and headphone sensing
TDA8552T; TDA8552TS
handbook, full pagewidth
77
79
top view
bottom view
GND 220 F
+Vdd
1.5 k
UP 100 nF IN1 MODE 330 nF 20 330 nF 220 F 1 150 nF TDA8552/53TS 100 k 1.5 k DOWN 820 k
IN2 20 dB 30 dB 1 k 220 F 5 HP 5
TDA 8552/53TS
Analog Audio CIC - Nijmegen
- OUT1 +
220 F
1 k
- OUT2 +
MGR015
Fig.18 Printed-circuit board layout.
1998 Jun 02
20
Philips Semiconductors
Preliminary specification
2 x 1.4 W BTL audio amplifiers with digital volume control and headphone sensing
PACKAGE OUTLINES SO20: plastic small outline package; 20 leads; body width 7.5 mm
TDA8552T; TDA8552TS
SOT163-1
D
E
A X
c y HE vMA
Z 20 11
Q A2 A1 pin 1 index Lp L 1 e bp 10 wM detail X (A 3) A
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT163-1 REFERENCES IEC 075E04 JEDEC MS-013AC EIAJ EUROPEAN PROJECTION A max. 2.65 0.10 A1 0.30 0.10 A2 2.45 2.25 A3 0.25 0.01 bp 0.49 0.36 c 0.32 0.23 D (1) 13.0 12.6 0.51 0.49 E (1) 7.6 7.4 0.30 0.29 e 1.27 0.050 HE 10.65 10.00 L 1.4 Lp 1.1 0.4 Q 1.1 1.0 0.043 0.039 v 0.25 0.01 w 0.25 0.01 y 0.1 0.004 Z
(1)
0.9 0.4 0.035 0.016
0.012 0.096 0.004 0.089
0.019 0.013 0.014 0.009
0.419 0.043 0.055 0.394 0.016
8o 0o
ISSUE DATE 95-01-24 97-05-22
1998 Jun 02
21
Philips Semiconductors
Preliminary specification
2 x 1.4 W BTL audio amplifiers with digital volume control and headphone sensing
TDA8552T; TDA8552TS
SSOP20: plastic shrink small outline package; 20 leads; body width 4.4 mm
SOT266-1
D
E
A X
c y HE vM A
Z
20
11
Q A2 pin 1 index A1 (A 3) Lp L A
1
e bp
10
detail X wM
0
2.5 scale
5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max. 1.5 A1 0.15 0 A2 1.4 1.2 A3 0.25 bp 0.32 0.20 c 0.20 0.13 D (1) 6.6 6.4 E (1) 4.5 4.3 e 0.65 HE 6.6 6.2 L 1.0 Lp 0.75 0.45 Q 0.65 0.45 v 0.2 w 0.13 y 0.1 Z (1) 0.48 0.18 10 0o
o
Note 1. Plastic or metal protrusions of 0.20 mm maximum per side are not included. OUTLINE VERSION SOT266-1 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION
ISSUE DATE 90-04-05 95-02-25
1998 Jun 02
22
Philips Semiconductors
Preliminary specification
2 x 1.4 W BTL audio amplifiers with digital volume control and headphone sensing
SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "IC Package Databook" (order code 9398 652 90011). Reflow soldering Reflow soldering techniques are suitable for all SO and SSOP packages. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 C. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 C. Wave soldering SO Wave soldering techniques can be used for all SO packages if the following conditions are observed: * A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. * The longitudinal axis of the package footprint must be parallel to the solder flow. * The package footprint must incorporate solder thieves at the downstream end. SSOP
TDA8552T; TDA8552TS
Wave soldering is not recommended for SSOP packages. This is because of the likelihood of solder bridging due to closely-spaced leads and the possibility of incomplete solder penetration in multi-lead devices. If wave soldering cannot be avoided, the following conditions must be observed: * A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. * The longitudinal axis of the package footprint must be parallel to the solder flow and must incorporate solder thieves at the downstream end. Even with these conditions, only consider wave soldering SSOP packages that have a body width of 4.4 mm, that is SSOP16 (SOT369-1) or SSOP20 (SOT266-1). METHOD (SO AND SSOP) During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Maximum permissible solder temperature is 260 C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 C within 6 seconds. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Repairing soldered joints Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C.
1998 Jun 02
23
Philips Semiconductors
Preliminary specification
2 x 1.4 W BTL audio amplifiers with digital volume control and headphone sensing
DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values
TDA8552T; TDA8552TS
This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
1998 Jun 02
24
Philips Semiconductors
Preliminary specification
2 x 1.4 W BTL audio amplifiers with digital volume control and headphone sensing
NOTES
TDA8552T; TDA8552TS
1998 Jun 02
25
Philips Semiconductors
Preliminary specification
2 x 1.4 W BTL audio amplifiers with digital volume control and headphone sensing
NOTES
TDA8552T; TDA8552TS
1998 Jun 02
26
Philips Semiconductors
Preliminary specification
2 x 1.4 W BTL audio amplifiers with digital volume control and headphone sensing
NOTES
TDA8552T; TDA8552TS
1998 Jun 02
27
Philips Semiconductors - a worldwide company
Argentina: see South America Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113, Tel. +61 2 9805 4455, Fax. +61 2 9805 4466 Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. +43 160 1010, Fax. +43 160 101 1210 Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6, 220050 MINSK, Tel. +375 172 200 733, Fax. +375 172 200 773 Belgium: see The Netherlands Brazil: see South America Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor, 51 James Bourchier Blvd., 1407 SOFIA, Tel. +359 2 689 211, Fax. +359 2 689 102 Canada: PHILIPS SEMICONDUCTORS/COMPONENTS, Tel. +1 800 234 7381 China/Hong Kong: 501 Hong Kong Industrial Technology Centre, 72 Tat Chee Avenue, Kowloon Tong, HONG KONG, Tel. +852 2319 7888, Fax. +852 2319 7700 Colombia: see South America Czech Republic: see Austria Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S, Tel. +45 32 88 2636, Fax. +45 31 57 0044 Finland: Sinikalliontie 3, FIN-02630 ESPOO, Tel. +358 9 615800, Fax. +358 9 61580920 France: 51 Rue Carnot, BP317, 92156 SURESNES Cedex, Tel. +33 1 40 99 6161, Fax. +33 1 40 99 6427 Germany: Hammerbrookstrae 69, D-20097 HAMBURG, Tel. +49 40 23 53 60, Fax. +49 40 23 536 300 Greece: No. 15, 25th March Street, GR 17778 TAVROS/ATHENS, Tel. +30 1 4894 339/239, Fax. +30 1 4814 240 Hungary: see Austria India: Philips INDIA Ltd, Band Box Building, 2nd floor, 254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025, Tel. +91 22 493 8541, Fax. +91 22 493 0966 Indonesia: PT Philips Development Corporation, Semiconductors Division, Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510, Tel. +62 21 794 0040 ext. 2501, Fax. +62 21 794 0080 Ireland: Newstead, Clonskeagh, DUBLIN 14, Tel. +353 1 7640 000, Fax. +353 1 7640 200 Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053, TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007 Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3, 20124 MILANO, Tel. +39 2 6752 2531, Fax. +39 2 6752 2557 Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108-8507, Tel. +81 3 3740 5130, Fax. +81 3 3740 5077 Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL, Tel. +82 2 709 1412, Fax. +82 2 709 1415 Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR, Tel. +60 3 750 5214, Fax. +60 3 757 4880 Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905, Tel. +9-5 800 234 7381 Middle East: see Italy Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB, Tel. +31 40 27 82785, Fax. +31 40 27 88399 New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND, Tel. +64 9 849 4160, Fax. +64 9 849 7811 Norway: Box 1, Manglerud 0612, OSLO, Tel. +47 22 74 8000, Fax. +47 22 74 8341 Pakistan: see Singapore Philippines: Philips Semiconductors Philippines Inc., 106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI, Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474 Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA, Tel. +48 22 612 2831, Fax. +48 22 612 2327 Portugal: see Spain Romania: see Italy Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW, Tel. +7 095 755 6918, Fax. +7 095 755 6919 Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762, Tel. +65 350 2538, Fax. +65 251 6500 Slovakia: see Austria Slovenia: see Italy South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale, 2092 JOHANNESBURG, P.O. Box 7430 Johannesburg 2000, Tel. +27 11 470 5911, Fax. +27 11 470 5494 South America: Al. Vicente Pinzon, 173, 6th floor, 04547-130 SAO PAULO, SP, Brazil, Tel. +55 11 821 2333, Fax. +55 11 821 2382 Spain: Balmes 22, 08007 BARCELONA, Tel. +34 93 301 6312, Fax. +34 93 301 4107 Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM, Tel. +46 8 5985 2000, Fax. +46 8 5985 2745 Switzerland: Allmendstrasse 140, CH-8027 ZURICH, Tel. +41 1 488 2741 Fax. +41 1 488 3263 Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1, TAIPEI, Taiwan Tel. +886 2 2134 2865, Fax. +886 2 2134 2874 Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd., 209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260, Tel. +66 2 745 4090, Fax. +66 2 398 0793 Turkey: Talatpasa Cad. No. 5, 80640 GULTEPE/ISTANBUL, Tel. +90 212 279 2770, Fax. +90 212 282 6707 Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7, 252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461 United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes, MIDDLESEX UB3 5BX, Tel. +44 181 730 5000, Fax. +44 181 754 8421 United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409, Tel. +1 800 234 7381 Uruguay: see South America Vietnam: see Singapore Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD, Tel. +381 11 625 344, Fax.+381 11 635 777 Internet: http://www.semiconductors.philips.com
For all other countries apply to: Philips Semiconductors, International Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 (c) Philips Electronics N.V. 1998
SCA60
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
545102/1200/02/pp28
Date of release: 1998 Jun 02
Document order number:
9397 750 03733

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